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Vacuum Reflow Oven - List of Manufacturers, Suppliers, Companies and Products

Vacuum Reflow Oven Product List

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Ultra-compact vacuum reflow furnace TRF-125V

Ultra-compact vacuum reflow furnace TRF-125V

Finally on sale! ~Ultra-compact vacuum reflow oven~

We are pleased to announce the launch of the vacuum reflow oven (TRF-125V) in our highly acclaimed reflow oven series! ■ Despite its reasonable price, this unit allows for reflow in a vacuum environment or using nitrogen gas! ■ With its ultra-lightweight and compact design, it is one of the smallest in the world, making it easy to install in labs! ■ High temperature control capability with PID control! ■ Many options available, including a manometer, magnifying glass, general-purpose regulator, gas cylinders (N2, CO2), vacuum pump, and more!

  • Reflow Equipment

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Ultra-compact vacuum reflow oven TR-125V2

Ultra-compact vacuum reflow oven TR-125V2

The definitive version of the ultra-compact vacuum reflow oven!!

We are excited to announce the launch of the ultra-compact vacuum reflow oven (TR-125V2) in our highly acclaimed ultra-compact reflow oven series! This ultra-compact vacuum reflow oven is perfect for those who want to introduce a reflow oven but are struggling with high prices or lack of space, as well as for those who already own a reflow oven but find it cumbersome and time-consuming to operate a large reflow oven.

  • Other semiconductors

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Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Heating settings up to 450℃, compatible with formic acid reduction processes, standard equipped with substrate cooling function.

This is a tabletop vacuum reflow oven that significantly reduces voids inside solder by changing the pressure within the process chamber, enabling high-quality voidless soldering. The heating area measures 200mm x 200mm x height 50mm and supports heating from both above and below. The pressure can be set arbitrarily within the range of atmospheric pressure to 10Pa, allowing for flexible adjustment of pressure and heating profiles according to the target workpiece. By using an optional formic acid bubbler unit with a heat retention function, it generates a stable concentration of a mixed gas of formic acid and nitrogen, removing the oxide film from the workpiece through a reduction reaction, and it can also accommodate a fluxless soldering process that does not use flux.

  • Soldering Equipment
  • Reflow Equipment

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