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Vacuum Reflow Oven Product List

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Technical Data: Void Reduction Effect by Vacuum "Pressurized" Reflow

Technical Data: Void Reduction Effect by Vacuum "Pressurized" Reflow

Attention quality control and production management departments! We will introduce the verification results of vacuum pressure reflow, which is effective in reducing voids.

This document discusses the void reduction effects of vacuum pressure reflow. Using a vacuum reflow furnace, a method of reducing voids in solder joints through defoaming and compression is commonly utilized. However, to verify even more effective methods, we conducted reflow soldering using three different conditions and various test samples, and we present the results in detail with images. Please feel free to download and take a look. 【Contents】 ■ Importance of low-void soldering ■ Verification of effective processes for void reduction ■ Test samples ■ Test results ■ Summary of results *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Heating settings up to 450℃, compatible with formic acid reduction processes, standard equipped with substrate cooling function.

This is a tabletop vacuum reflow oven that significantly reduces voids inside solder by changing the pressure within the process chamber, enabling high-quality voidless soldering. The heating area measures 200mm x 200mm x height 50mm and supports heating from both above and below. The pressure can be set arbitrarily within the range of atmospheric pressure to 10Pa, allowing for flexible adjustment of pressure and heating profiles according to the target workpiece. By using an optional formic acid bubbler unit with a heat retention function, it generates a stable concentration of a mixed gas of formic acid and nitrogen, removing the oxide film from the workpiece through a reduction reaction, and it can also accommodate a fluxless soldering process that does not use flux.

  • Soldering Equipment
  • Reflow Equipment

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Ultra-compact vacuum reflow furnace TRF-125V

Ultra-compact vacuum reflow furnace TRF-125V

Finally on sale! ~Ultra-compact vacuum reflow oven~

We are pleased to announce the launch of the vacuum reflow oven (TRF-125V) in our highly acclaimed reflow oven series! ■ Despite its reasonable price, this unit allows for reflow in a vacuum environment or using nitrogen gas! ■ With its ultra-lightweight and compact design, it is one of the smallest in the world, making it easy to install in labs! ■ High temperature control capability with PID control! ■ Many options available, including a manometer, magnifying glass, general-purpose regulator, gas cylinders (N2, CO2), vacuum pump, and more!

  • Reflow Equipment

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Ultra-compact vacuum reflow oven TR-125V2

Ultra-compact vacuum reflow oven TR-125V2

The definitive version of the ultra-compact vacuum reflow oven!!

We are excited to announce the launch of the ultra-compact vacuum reflow oven (TR-125V2) in our highly acclaimed ultra-compact reflow oven series! This ultra-compact vacuum reflow oven is perfect for those who want to introduce a reflow oven but are struggling with high prices or lack of space, as well as for those who already own a reflow oven but find it cumbersome and time-consuming to operate a large reflow oven.

  • Other semiconductors

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Formic Acid Reduction Vacuum Reflow Furnace / Batch Type 'Model: SQ1'

Formic Acid Reduction Vacuum Reflow Furnace / Batch Type 'Model: SQ1'

Equipped with our unique decomposition processing unit! Completely neutralizes formic acid in exhaust.

The "Model: SQ1" is a compact batch-type formic acid reduction vacuum reflow furnace equipped with a heating and cooling mechanism in a single chamber, suitable for research and development as well as small-scale production. The formic acid reduction process eliminates the need for flux and flux cleaning in subsequent processes. Additionally, it allows for the use of a vacuum process effective in reducing voids. Since there is no need to transfer formic acid to a dedicated tank, customers can use the bottles or tanks they have prepared as is. 【Features】 ■ Equipped with our unique gas generator, achieving instantaneous vaporization ■ Incorporates our proprietary heating and cooling mechanism that combines radiation heating with IR heaters and forced water cooling with water-cooled plates ■ Contributes to shortening the reflow process from heating to cooling ■ No need to transfer formic acid to a dedicated tank ■ Equipped with our unique decomposition treatment unit, completely neutralizing formic acid in the exhaust *For more details, please refer to the related links or feel free to contact us.

  • Reflow Equipment

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Formic Acid Reduction Vacuum Reflow Furnace / Multi-Module Type 'MPX Series'

Formic Acid Reduction Vacuum Reflow Furnace / Multi-Module Type 'MPX Series'

No need to transfer formic acid to a dedicated tank! You can use the bottles or tanks prepared by the customer as they are.

The MPX series is a vacuum reflow furnace suitable for mass production, capable of installing multiple independent chamber modules that integrate heating and cooling. Thanks to the formic acid reduction process, there is no need for flux or flux cleaning in subsequent processes. Additionally, it is possible to utilize a vacuum process that is effective in reducing voids. It features our unique heating and cooling mechanism that combines radiation heating from IR heaters with forced water cooling from water-cooled plates. 【Features】 - Equipped with our proprietary gas generator, achieving instantaneous vaporization. - Incorporates our unique heating and cooling mechanism that combines radiation heating from IR heaters with forced water cooling from water-cooled plates. - Contributes to the reduction of the reflow process from heating to cooling. - No need to transfer formic acid to a dedicated tank. - Equipped with our unique decomposition processing unit, completely neutralizing formic acid in the exhaust. *For more details, please refer to the related links or feel free to contact us.

  • Reflow Equipment

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Formic acid reduction vacuum reflow furnace

Formic acid reduction vacuum reflow furnace

Formic acid molecules approach the work surface and actively remove (reduce) the oxide film.

We would like to introduce our "Flux-less Vacuum Reflow." Instead of flux, formic gas removes the oxide film on the metal surface, eliminating the need for flux cleaning in subsequent processes. (When using solder foil, dedicated paste, etc.) Additionally, by utilizing vacuum and re-pressurization, it effectively reduces solder splash and voids. 【Features】 ■ Direct vaporization of formic acid - High-speed vaporization (4g/sec) - No carrier gas required ■ High-speed heating through radiant heat - Maximum temperature: over 400℃ - High heating efficiency due to radiant heat *For more details, please download the PDF or feel free to contact us.

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  • Reflow Equipment

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